Method for manufacturing a semiconductor device

Details Method for manufacturing a semiconductor device Method for manufacturing a semiconductor device

2005-09-28

2008-12-02

Nguyen, Tuan H (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S112000, C438S126000

Reexamination Certificate

active

07459348

ABSTRACT:
A method for manufacturing a semiconductor device formed by stacking a plurality of semiconductor elements on a substrate includes the steps of stacking the plurality of semiconductor elements on the substrate to form plural stages, placing the substrate substantially vertically and charging an underfill agent into spaces defined between the substrate and the corresponding semiconductor element and spaces defined among the stacked semiconductor elements through a nozzle from above side faces of the stacked semiconductor elements, and curing the charged underfill agent.

REFERENCES:
patent: 5427938 (1995-06-01), Matsumura et al.
patent: 5766982 (1998-06-01), Akram et al.
patent: 6232667 (2001-05-01), Hultmark et al.
patent: 7061103 (2006-06-01), Chen et al.
patent: 2002/0115237 (2002-08-01), Williams
patent: 11-354552 (1999-12-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4030051