Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-09-28
2008-12-02
Nguyen, Tuan H (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S112000, C438S126000
Reexamination Certificate
active
07459348
ABSTRACT:
A method for manufacturing a semiconductor device formed by stacking a plurality of semiconductor elements on a substrate includes the steps of stacking the plurality of semiconductor elements on the substrate to form plural stages, placing the substrate substantially vertically and charging an underfill agent into spaces defined between the substrate and the corresponding semiconductor element and spaces defined among the stacked semiconductor elements through a nozzle from above side faces of the stacked semiconductor elements, and curing the charged underfill agent.
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patent: 6232667 (2001-05-01), Hultmark et al.
patent: 7061103 (2006-06-01), Chen et al.
patent: 2002/0115237 (2002-08-01), Williams
patent: 11-354552 (1999-12-01), None
Nguyen Tuan H
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
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