Method for manufacturing a semiconductor capacitor

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

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C257SE21647

Reexamination Certificate

active

07846808

ABSTRACT:
A method for manufacturing a semiconductor device that reduces the overall number of masking processes while also preventing short-circuiting between electrodes. The method can include sequentially forming a first insulating film, a lower metal layer, a second insulating material, an upper metal layer, and a third insulating material over a semiconductor substrate; forming a third insulating film and an upper electrode by performing a first etching process using a mask to pattern the third insulating material and the upper metal layer; and then forming a second insulating film and a lower electrode by performing a second etching process using the mask to pattern the second insulating material and the lower metal layer.

REFERENCES:
patent: 6831018 (2004-12-01), Kanegae
patent: 7233053 (2007-06-01), Koller et al.
patent: 2003/0008467 (2003-01-01), Kai et al.
patent: 2005/0272219 (2005-12-01), Coolbaugh et al.
patent: 2007/0148898 (2007-06-01), Lee
patent: 2007/0254417 (2007-11-01), Chen et al.
patent: 2008/0174015 (2008-07-01), Herrin et al.
patent: 1020030012484 (2003-02-01), None
patent: 1020040086705 (2004-10-01), None

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