Method for manufacturing a semiconductor

Details Method for manufacturing a semiconductor Method for manufacturing a semiconductor

1995-04-13

1997-10-07

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264261, 26427211, 26427213, 26427217, H01L 2156, B29C 4514

Patent

active

056743432

ABSTRACT:
A method of manufacturing a semiconductor and a lamination therefor, in which fixing materials are temporarily fixed to the molding faces of a mold through release films. The semiconductor element is then placed in the mold and molding resin is injected into the mold. The resin is heated to produce the semiconductor device. During this process, the fixing materials become embedded in each of the opposite surfaces of the resin.

REFERENCES:
patent: 2765248 (1956-10-01), Beech et al.
patent: 3715423 (1973-02-01), Dunn

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