Method for manufacturing a reflective surface sub-assembly...

Details Method for manufacturing a reflective surface sub-assembly... Method for manufacturing a reflective surface sub-assembly...

2011-06-14

2011-06-14

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S028000, C438S029000, C257SE33056, C257SE33067

Reexamination Certificate

active

07960194

ABSTRACT:
A method for manufacturing a reflective surface sub-assembly for a light-emitting device, comprising a substrate, at least one area reserved for placement of a light-emitting device assembly on the substrate, and a diffusive reflective layer applied on selected regions on the substrate, wherein if the light-emitting device assembly were placed onto the at least one area then the diffusive reflective layer would reflect photons emitted by the light-emitting device assembly is disclosed.

REFERENCES:
patent: 2006/0245208 (2006-11-01), Sakamoto et al.
patent: 2009/0322208 (2009-12-01), Shaikevitch et al.
patent: 2010/0164362 (2010-07-01), Miyakawa et al.

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