Semiconductor device manufacturing: process – Direct application of electrical current – To alter conductivity of fuse or antifuse element
Reexamination Certificate
2006-11-07
2006-11-07
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Direct application of electrical current
To alter conductivity of fuse or antifuse element
C438S131000, C438S600000
Reexamination Certificate
active
07132350
ABSTRACT:
A method for manufacturing an electrically programmable non-volatile memory cell comprises forming a first electrode on a substrate, forming an inter-electrode layer of material on the first electrode having a property which is characterized by progressive change in response to stress, and forming a second electrode over the inter-electrode layer of material. The inter-electrode layer comprises a dielectric layer, such as ultra-thin oxide, between the first and second electrodes. A programmable resistance, or other property, is established by stressing the dielectric layer, representing stored data. Embodiments of the memory cell are adapted to store multiple bits of data per cell and/or adapted for programming more than one time without an erase process.
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Lai Han Chao
Lu Chih Yuan
Lu Tao Cheng
Tsai Wen Jer
Yeh Chih Chieh
Duong Khanh
Haynes Mark
Haynes Beffel & Wolfeld LLP
Macronix International Co. Ltd.
Smith Zandra V.
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