Etching a substrate: processes – Forming or treating an article whose final configuration has...
Reexamination Certificate
2011-01-04
2011-01-04
Olsen, Allan (Department: 1716)
Etching a substrate: processes
Forming or treating an article whose final configuration has...
C216S012000, C216S039000
Reexamination Certificate
active
07862733
ABSTRACT:
The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so as to form a recess in the sacrificial layer. A mask that exposes an area formed in a desired probe flat surface shape containing the recess is formed on the sacrificial layer. A probe material exhibiting different etching resistance characteristics from those of the sacrificial layer is deposited in the area exposed from the mask. By the deposition of the material, a coupling portion corresponding to the recess and a probe that is integral with the coupling portion are formed. After the mask is removed, the sacrificial layer is removed with use of etchant. Thereafter, the probe held on the base table at the coupling portion is detached from the base table together with the coupling portion.
REFERENCES:
patent: 5883387 (1999-03-01), Matsuyama et al.
patent: 6358426 (2002-03-01), Muramatsu et al.
patent: 6672875 (2004-01-01), Mathieu et al.
patent: 6939474 (2005-09-01), Eldridge et al.
patent: 7048548 (2006-05-01), Mathieu et al.
patent: 7151385 (2006-12-01), Hirata et al.
patent: 7285966 (2007-10-01), Lee et al.
patent: 7412767 (2008-08-01), Kim et al.
patent: 7459399 (2008-12-01), Kim et al.
patent: 7523539 (2009-04-01), Hayashizaki et al.
patent: 7586321 (2009-09-01), Hirakawa et al.
patent: 7678587 (2010-03-01), Kim et al.
patent: 7737714 (2010-06-01), Hsu
patent: 2003/0119221 (2003-06-01), Cunningham et al.
patent: 2005/0221644 (2005-10-01), Kim et al.
patent: 2006/0019027 (2006-01-01), Eldridge et al.
patent: 2006/0073627 (2006-04-01), Park et al.
patent: 2006/0132153 (2006-06-01), Gritters
patent: 2006/0192581 (2006-08-01), Lee
patent: 2007/0152685 (2007-07-01), Eldridge et al.
patent: 2007/0247175 (2007-10-01), Khandros et al.
patent: 2007/0279043 (2007-12-01), Takahashi
patent: 2007/0296435 (2007-12-01), Eldridge et al.
patent: 2008/0048687 (2008-02-01), Jung
patent: 2008/0079453 (2008-04-01), Lee
patent: 2008/0111573 (2008-05-01), Chen et al.
patent: 2008/0142709 (2008-06-01), Sumant et al.
patent: 2008/0143368 (2008-06-01), Hayashizaki et al.
patent: 2008/0186041 (2008-08-01), Lee
patent: 2010/0155253 (2010-06-01), Kim et al.
patent: 10221369 (1998-08-01), None
patent: 2000-162241 (2000-06-01), None
patent: 1020060021420 (2006-03-01), None
patent: WO 2004/102207 (2004-11-01), None
Office Action for KR 2007-133466, Jul. 28, 2009, Kabushiki Kaisha Nihon Micronics.
Hamada Kazuhito
Hayashizaki Takayuki
Hirakawa Hideki
Soma Akira
Ingrassia Fisher & Lorenz P.C.
Kabushiki Kaisha Nihon Micronics
Olsen Allan
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