Method for manufacturing a probe

Metal working – Method of mechanical manufacture – Electrical device making

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174260, 437 8, H05K 302

Patent

active

055134300

ABSTRACT:
A probe card (40, 55) having probe card probes (36, 56) and a method for fabricating the probe card probes (36, 56). A layer of resist (23) is formed on a plating base (21). The layer of resist (23) is exposed to radiation (32) and developed to provide angled, tapered openings (33) exposing portions of the plating base (22). An electrically conductive material is electroplated on the exposed portions of the plating base (22) and fills the angled, tapered openings (33). The layer of resist (23) and portions of the plating base (22) between the electroplated conductive material are removed. The electrically conductive material forms the probe card probes (36) which are angled and tapered. In addition, the compliant probe card probes (56) may be stair-step shaped.

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Munchmeyer et al., "Manufacture of three-dimensional microdevices using synchrotron radiation (invited)", Rev. Sci Instrum. 63(1), Jan. 1992, pp. 713-721.
C. Barsotti et al., "Very High Density Probing", 1988 International Test Conference, Paper 30.2, pp. 608-614.

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