Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-08-02
1994-05-03
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427404, 427405, C23C 2600
Patent
active
053086449
ABSTRACT:
The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.
REFERENCES:
patent: 4622239 (1986-11-01), Schoenthaler
patent: 4664945 (1987-05-01), Maeda
patent: 4720402 (1988-01-01), Wojcik
patent: 4970354 (1990-11-01), Iwasa
patent: 5030800 (1991-07-01), Kawakami
patent: 5055321 (1991-10-01), Enomoto
patent: 5112648 (1992-05-01), Okonogi
patent: 5133120 (1992-07-01), Kawakami
Haruyama Satoshi
Kawakami Shin
Okonogi Hirotaka
Adams Bruce L.
Beck Shrive
Dang Vi Duong
Nippon CMK Corp.
Wilks Van C.
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