Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2008-05-12
2011-12-27
Stoner, Kiley (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S215000, C438S613000
Reexamination Certificate
active
08083123
ABSTRACT:
A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 μm to 18 μm. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature.
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Office Action issued on Sep. 1, 2010, in Taiwanese Patent Application No. 096102452.
Kawamura Youichirou
Tanno Katsuhiko
IBIDEN Co., Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Stoner Kiley
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