Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2008-05-13
2010-12-07
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S223000, C228S248100, C228S246000
Reexamination Certificate
active
07845547
ABSTRACT:
A method for manufacturing a printed wiring board having a bump. The method includes forming a solder-resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective conductive pad of the printed wiring board, and printing a solder paste in the large-diameter aperture in the solder-resist layer, but not printing the solder paste in the small-diameter aperture in the solder resist layer. The method also includes loading a solder ball in each of the large-diameter aperture and the small-diameter aperture using a mask having aperture areas that correspond to the small-diameter aperture and large-diameter aperture of the solder-resist layer, and forming a small-diameter bump from the solder ball in the small-diameter aperture and a large-diameter bump from both the solder paste and the solder ball in the large-diameter aperture.
REFERENCES:
patent: 5641113 (1997-06-01), Somaki et al.
patent: 6189771 (2001-02-01), Maeda et al.
patent: 6191022 (2001-02-01), Creswick
patent: 6660944 (2003-12-01), Murata et al.
patent: 7472473 (2009-01-01), Kawamura et al.
patent: 7475803 (2009-01-01), Sumita et al.
patent: 7654432 (2010-02-01), MacKay et al.
patent: 2003/0157761 (2003-08-01), Sakuyama
patent: 2006/0157540 (2006-07-01), Sumita et al.
patent: 2006/0208041 (2006-09-01), MacKay et al.
patent: 2008/0078810 (2008-04-01), Kawamura et al.
patent: 2009/0250813 (2009-10-01), Lin et al.
patent: 7-201870 (1995-08-01), None
patent: 9-57432 (1997-03-01), None
patent: 9-107045 (1997-04-01), None
patent: 2001-267731 (2001-09-01), None
patent: 2005-209847 (2005-08-01), None
patent: WO 2006/013742 (2006-02-01), None
U.S. Appl. No. 12/120,076, filed May 13, 2008, Tanno et al.
U.S. Appl. No. 12/093,436, filed May 12, 2008, Tanno et al.
IBIDEN Co., Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Stoner Kiley
LandOfFree
Method for manufacturing a printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4177811