Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2009-05-15
2011-11-01
Chen, Xiaoliang (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C361S280000, C029S852000, C257S275000, C257S306000, C257S310000, C257S532000, C257S778000, C438S096000, C438S166000, C438S197000, C438S240000, C438S455000, C438S458000, C438S627000, C438S795000
Reexamination Certificate
active
08049117
ABSTRACT:
A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.
REFERENCES:
patent: 3615875 (1971-10-01), Morita et al.
patent: 4305973 (1981-12-01), Yaron et al.
patent: 4370510 (1983-01-01), Stirn
patent: 4542578 (1985-09-01), Yamano et al.
patent: 5008513 (1991-04-01), Najafi-Sani et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5484686 (1996-01-01), Maeda et al.
patent: 5631895 (1997-05-01), Okada et al.
patent: 5780873 (1998-07-01), Itaya et al.
patent: 5810945 (1998-09-01), Stutzmann et al.
patent: 5946562 (1999-08-01), Kuo
patent: 5990507 (1999-11-01), Mochizuki et al.
patent: 6091026 (2000-07-01), Yang
patent: 6177151 (2001-01-01), Chrisey et al.
patent: 6194650 (2001-02-01), Wakayama et al.
patent: 6258449 (2001-07-01), Nagasawa
patent: 6316339 (2001-11-01), Okusa et al.
patent: 6416837 (2002-07-01), Kojima et al.
patent: 6456584 (2002-09-01), Nagata et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6632314 (2003-10-01), Yu et al.
patent: 6642091 (2003-11-01), Tanabe
patent: 6677173 (2004-01-01), Ota
patent: 6696326 (2004-02-01), Zhang et al.
patent: 6835531 (2004-12-01), Yoon et al.
patent: 6841217 (2005-01-01), Nishihara et al.
patent: 6841883 (2005-01-01), Farnworth et al.
patent: 6902716 (2005-06-01), Lee et al.
patent: 7067198 (2006-06-01), Yamada et al.
patent: 7081642 (2006-07-01), Onozuka et al.
patent: 7150865 (2006-12-01), Harutyunyan et al.
patent: 7309395 (2007-12-01), Lee et al.
patent: 7356060 (2008-04-01), Mochida
patent: 7435675 (2008-10-01), Seh et al.
patent: 7495177 (2009-02-01), Kataoka et al.
patent: 2001/0012257 (2001-08-01), Suzuki et al.
patent: 2002/0004124 (2002-01-01), Hirasawa et al.
patent: 2002/0052069 (2002-05-01), Jiroku et al.
patent: 2002/0117199 (2002-08-01), Oswald
patent: 2002/0168475 (2002-11-01), Yamaji et al.
patent: 2003/0040164 (2003-02-01), Inoue et al.
patent: 2003/0044539 (2003-03-01), Oswald
patent: 2003/0049913 (2003-03-01), Gaku et al.
patent: 2003/0071300 (2003-04-01), Yashima et al.
patent: 2003/0197214 (2003-10-01), Hartzell
patent: 2003/0216538 (2003-11-01), Kawano et al.
patent: 2004/0062858 (2004-04-01), Sato et al.
patent: 2004/0075388 (2004-04-01), Miyashita et al.
patent: 2004/0110395 (2004-06-01), Ueda et al.
patent: 2004/0121529 (2004-06-01), Sohn et al.
patent: 2004/0241487 (2004-12-01), Nagatani
patent: 2005/0012221 (2005-01-01), Kirby et al.
patent: 2005/0056942 (2005-03-01), Pogge et al.
patent: 2005/0056943 (2005-03-01), Pogge et al.
patent: 2005/0074694 (2005-04-01), Nishihara et al.
patent: 2005/0082636 (2005-04-01), Yashima et al.
patent: 2005/0167663 (2005-08-01), Sasaki
patent: 2005/0207331 (2005-09-01), Shinkai et al.
patent: 2005/0281304 (2005-12-01), Mochida
patent: 2006/0018241 (2006-01-01), Shingai et al.
patent: 2006/0044734 (2006-03-01), Ahn et al.
patent: 2006/0068563 (2006-03-01), Wong et al.
patent: 2006/0076584 (2006-04-01), Kim et al.
patent: 2006/0099747 (2006-05-01), Park
patent: 2006/0130956 (2006-06-01), White et al.
patent: 2006/0231853 (2006-10-01), Tanaka
patent: 2007/0065759 (2007-03-01), Kitaura et al.
patent: 2009/0003174 (2009-01-01), Tsuchino et al.
patent: 2009/0140255 (2009-06-01), Kimura et al.
patent: 2009/0261347 (2009-10-01), Kasu et al.
patent: 1741707 (2006-03-01), None
patent: 2002-222773 (2002-08-01), None
patent: 2003-347587 (2003-12-01), None
patent: 2004-072052 (2004-03-01), None
patent: 2006-179910 (2006-07-01), None
patent: 2006-179911 (2006-07-01), None
United States Office Action issued in U.S. Appl. No. 11/808,298 dated Feb. 3, 2010.
Chinese Office Action, w/ English translation thereof, issued in Chinese Patent Application No. CN 200710108648.0 dated Jan. 29, 2010.
Japanese Decision of Rejection, with English translation, issued in Japanese Patent Application No. 2007-144890, mailed Mar. 16, 2010.
United States Office Action issued in U.S. Appl. No. 11/808,298, mailed May 25, 2010.
Japanese Office Action issued in Japanese Patent Application No. JP 2007-144890 dated Aug. 11, 2009.
United States Office Action issued in U.S. Appl. No. 11/808,298 dated Oct. 5, 2009.
United States Office Action issued in U.S. Appl. No. 12/466,770 dated Feb. 23, 2011.
United States Office Action issued in U.S. Appl. No. 11/808,298 dated Feb. 17, 2011.
Chung Yul Kyo
Lee In Hyung
Lee Jung Won
Chen Xiaoliang
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Method for manufacturing a printed circuit board with a thin... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a printed circuit board with a thin..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a printed circuit board with a thin... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4289592