Method for manufacturing a printed circuit board having electrod

Details Method for manufacturing a printed circuit board having electrod Method for manufacturing a printed circuit board having electrod

1994-12-19

1996-03-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 29846, 174260, 174262, 174265, 22818021, 427 97, H01K 310

Patent

active

054994470

ABSTRACT:
The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.

REFERENCES:
patent: 4372046 (1983-02-01), Suzuki
patent: 4543715 (1985-10-01), Iadarola et al.
patent: 4790894 (1988-12-01), Homma
patent: 4821007 (1989-04-01), Fields et al.
patent: 5140745 (1992-08-01), McKenzie, Jr.

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