Method for manufacturing a printed circuit board

Details Method for manufacturing a printed circuit board Method for manufacturing a printed circuit board

2005-02-08

2005-02-08

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S839000, C029S840000, C029S846000, C029S852000, C174S254000, C174S255000, C361S749000, C361S779000, C438S182000

Reexamination Certificate

active

06851184

ABSTRACT:
A printed circuit board (PCB) and method of forming same is performed without incoming lines for plating. The plating is preferably performed on ball pad areas and/or bonding pad areas being the top layer of a multi-layer PCB. A metal layer that later forms circuit patterns serves to supply a power for plating ball pads for solder-ball bonding and bonding pads for wire-bonding with gold (Au). Thus, the gold (Au)-plating is performed prior to forming the circuit patterns. A positive-type first photoresist is coated on the metal layer to form the ball pads and the bonding pads. The coated first photoresist is also used to form circuit patterns. The gold (Au)-plated metal layer of ball pad areas and the bonding pad areas are protected by a second photoresist, which is reactive with a larger quantity of light than the first photoresist. Both first and second photoresists can be concurrently developed.

REFERENCES:
patent: 6265301 (2001-07-01), Lee et al.
patent: 6383401 (2002-05-01), Labzentis et al.
patent: 6684497 (2004-02-01), Appelt et al.

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