Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1997-09-23
2001-06-26
Young, Lee (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S832000, C029S825000
Reexamination Certificate
active
06249964
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for manufacturing a printed circuit board.
2. Description of the Background Art
Conventional methods for manufacturing a printed circuit board comprise opening holes in a copper plate, filling epoxy resins in the holes, additionally forming circuit layers on both the faces of two first resin plates, further forming circuit layers on one face of the two second resin plates and simultaneously attaching copper foils on the other face thereof, bonding the first resin plates on both the faces of the copper plate by means of prepreg, further bonding the second resin plates on both the faces thereof by means of prepreg, opening through the copper plate, the first resin plates and the second resin plates through-hole openings with the center line approximately lying on the center line of the holes, forming a copper-plated layer by electroless copper plating and subsequent electrolytic copper plating, and selectively etching the copper-plated layer and the copper foils, thereby providing through holes.
According to such methods for manufacturing a printed circuit board, an interface is present between the first and second resin plates as the insulating layers and the prepreg, and therefore, the resulting printed circuit board may eventually be warped.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method for manufacturing a printed circuit board, with no occurrence of any warpage of the printed circuit board.
According to the present invention, a method for manufacturing a printed circuit board is provided, comprising attaching first metal foils through first resins dissolved in solvents on both the faces of a metal plate, selectively etching the first metal foils, attaching second metal foils through the first resins dissolved in the solvents on both the faces, opening connection holes in the second metal foils and resin layers consisting of the first resins, forming plated layers on both the faces, and selectively etching the second metal foils and the plated layers.
By the method for manufacturing a printed circuit board, no interface is present in the resin layer as the insulating layer, and therefore, no warpage occurs in the printed circuit board.
Other objects and further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
REFERENCES:
patent: 5093761 (1992-03-01), Ozaki
Birch & Stewart Kolasch & Birch, LLP
O.K. Print Corporation
Smith Sean
Young Lee
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