Method for manufacturing a polyimide multilayer wiring substrate

Details Method for manufacturing a polyimide multilayer wiring substrate Method for manufacturing a polyimide multilayer wiring substrate

1994-10-25

1997-05-13

Johnstone, Adrienne C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29830, 29831, 29840, 156 60, H05K 334, H05K 336, B32B 3104, B32B 3120

Patent

active

056288522

ABSTRACT:
A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.

REFERENCES:
patent: 3958317 (1976-05-01), Peart et al.
patent: 4680226 (1987-07-01), Takeda
patent: 4736521 (1988-04-01), Dohya
patent: 4774127 (1988-09-01), Reagan et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5152868 (1992-10-01), Schiltz et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5337466 (1994-08-01), Ishida
patent: 5426849 (1995-06-01), Kinbara et al.
Herman N. K. "Multilayer Laminates" IBM Technical Disclosure Bulletin vol. 11, No. 8, Jan. 1969.

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