Method for manufacturing a plastic encapsulated semiconductor de

Details Method for manufacturing a plastic encapsulated semiconductor de Method for manufacturing a plastic encapsulated semiconductor de

1985-01-17

1987-01-20

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29591, 29576S, 357 70, H01L 2156

Patent

active

046371303

ABSTRACT:
A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. An external lead of a lead frame extends to one side of a substrate support serving as a heat sink and supporting a semiconductor substrate, and strips of the lead frame extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds for plastic encapsulation so that a thin film of plastic is uniformly formed on a lower surface of the substrate support. A connecting portion between the external lead and a connecting band and the strips extending from a plastic encapsulating housing to the outside are cut.

REFERENCES:
patent: 4451973 (1985-06-01), Tateno et al.
patent: 4507675 (1985-03-01), Fujii et al.

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