Method for manufacturing a plastic encapsulated semiconductor de

Details Method for manufacturing a plastic encapsulated semiconductor de Method for manufacturing a plastic encapsulated semiconductor de

1982-02-25

1985-03-26

James, Andrew J.

357 72, 357 68, H01L 2156, H01L 2330, H01L 2158

Patent

active

045076758

ABSTRACT:
A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. An external lead of a lead frame extends to one side of a substrate support serving as a heat sink and supporting a semiconductor substrate, and strips of the lead frame extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds for plastic encapsulation, so that a thin film of plastic is uniformly formed on a lower surface of the substrate support. A connecting portion between the external lead and a connecting band and the strips extending from a plastic encapsulating housing to the outside are cut.

REFERENCES:
patent: 3431092 (1969-03-01), Lehner
patent: 3930114 (1975-12-01), Hodge
patent: 4017495 (1977-04-01), Jaffe et al.
patent: 4250347 (1981-02-01), Fierkens
patent: 4298883 (1981-11-01), Komatsu et al.

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