Method for manufacturing a pin and pipe assembly for a bare chip

Details Method for manufacturing a pin and pipe assembly for a bare chip Method for manufacturing a pin and pipe assembly for a bare chip

1995-11-28

1998-10-13

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29876, 324755, H01K 4316

Patent

active

058194100

ABSTRACT:
A bare chip testing socket is provided which includes a base plate having electrodes formed thereon to have the same pattern as a semiconductor chip having a large number of electrodes; a pin assembly, arranged between the semiconductor chip and the base plate, having a large number of testing pins for respectively connecting the electrodes of the semiconductor chip to the electrodes of the base plate; and pressing means for pressing the semiconductor chip to press the electrodes of the semiconductor chip against the test pins of the pin assembly; and methods for manufacturing a pin assembly and pipe assembly constructing the bare chip testing socket are provided. The large number of test pins of the pin assembly are fixed on an insulating member whose outer periphery is surrounded by a frame member, each of the test pins penetrates the insulating member in a thickness direction thereof with both end portions of each test pin exposed from the insulating member by a preset length, and the pipe assembly for guiding the test pins to the respective electrodes of the semiconductor chip is arranged between the semiconductor chip and the pin assembly.

REFERENCES:
patent: 4038599 (1977-07-01), Bove et al.
patent: 5015946 (1991-05-01), Janko
patent: 5174519 (1754-05-01), Collins et al.
patent: 5175496 (1992-12-01), Collins et al.
patent: 5347215 (1994-09-01), Armstrong et al.
patent: 5399982 (1995-03-01), Driller et al.

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