Method for manufacturing a piezoelectric vibration device

Details Method for manufacturing a piezoelectric vibration device Method for manufacturing a piezoelectric vibration device

2006-06-30

2008-09-09

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S847000, C029S830000, C310S31300R, C310S340000, C310S348000, C310S365000, C333S193000

Reexamination Certificate

active

07421767

ABSTRACT:
Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole to the cover so that a profile of an edge of an opening of the through hole at a first surface of the cover is positioned inside an outer shape of the taking out electrode in a plan view when the cover and the piezoelectric substrate are overlapped; forming a first glass film on the first surface of the cover; forming a second glass film on the first surface of the cover; bonding the first glass film to the taking out electrode as well as the second glass film to the bonding electrode by generating an electric field; and cutting an electrical coupling between the taking out electrode and the bonding electrode after step (e).

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Lee et al, “Fabrication of a ZNO Piezoelectric Cantilever with a High-Aspect Ratio Nano Tip”, IEEE 6th Annual Conference on Micro Electro Mechanical Systems, Jan. 2003, pp. 72-75.

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