Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2011-07-12
2011-07-12
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S940000, C257S072000, C257S059000
Reexamination Certificate
active
07977212
ABSTRACT:
For manufacturing a photovoltaic module (1) having on a transparent substrate (2) a transparent front electrode layer (3), a semiconductor layer (4) and a back electrode layer (5) as functional layers, the functional layers (3-5) are removed in the edge area (10) of the substrate (2) with a laser emitting infrared radiation. Subsequently, a back cover (12) is laminated on the coated substrate (2) with an adhesive film (11).
REFERENCES:
patent: 7470490 (2008-12-01), Nishikawa et al.
patent: 2007/0163646 (2007-07-01), Kushiya et al.
patent: 199 33 703 (2000-10-01), None
patent: 1005096 (2000-05-01), None
Lechner Peter
Psyk Walter
Maki Mark L.
Miller Canfield Paddock and Stone
Schott Solar AG
Stark Jarrett J
Tobergte Nicholas
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