Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-07-30
2008-10-21
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S531000, C257S532000
Reexamination Certificate
active
07439606
ABSTRACT:
An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.
REFERENCES:
patent: 5446309 (1995-08-01), Adachi et al.
patent: 7233055 (2007-06-01), Grange
patent: 2005/0269657 (2005-12-01), Dupuis
Li Qiang
Liu Lianjun
Miller Melvy F.
Pacheco Sergio P.
Freescale Semiconductor Inc.
Ingrassia Fisher & Lorenz P.C.
Nguyen Cuong Q
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