Method for manufacturing a package structure having a heat sprea

Details Method for manufacturing a package structure having a heat sprea Method for manufacturing a package structure having a heat sprea

1999-03-05

2000-12-19

Nelms, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438122, H10L 2144

Patent

active

061626597

ABSTRACT:
A method for manufacturing package structure integrated circuit chips having a heat spreader is disclosed. A wiring substrate is first provided. An integrated circuit chip, having a first surface and a second surface, is then electrically and mechanically connected to the wiring substrate via a first set of solder joints. A heat spreader is subsequently connected to the second surface of the integrated circuit chip via a second set of solder joints. The heat spreader includes an adhesion-promotion layer on a silicon layer.

REFERENCES:
patent: 5592735 (1997-01-01), Ozawa et al.
patent: 5777385 (1998-07-01), Wu

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