Method for manufacturing a multilayer wiring board

Details Method for manufacturing a multilayer wiring board Method for manufacturing a multilayer wiring board

2008-04-08

2010-06-15

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S620000, C029S852000, C174S260000, C257S537000

Reexamination Certificate

active

07735221

ABSTRACT:
A method of manufacturing a multilayer wiring board is provided. A flat surface is formed on a surface of a multilayer wiring layer, and resistive material is deposited on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach.

REFERENCES:
patent: 4870746 (1989-10-01), Klaser
patent: 6727556 (2004-04-01), Shiiki et al.
patent: 2000-013016 (2000-01-01), None
patent: 2005-017121 (2005-01-01), None
Pat. Abstract of JP (2000-013016), Jan. 14, 2000, NEC Corporation.
Pat. Abstract of JP (2005-017121), Jan. 20, 2005, Micronics Japan Co LTD.

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