Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2008-07-18
2010-12-07
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE21614, C257S685000, C257S686000, C257S723000, C438S108000
Reexamination Certificate
active
07847415
ABSTRACT:
A multichip module assembly includes a chipset of at least two chips. The chips have active sides, rear sides and chip contacts on their active sides adjacent each other and are embedded in a polymer matrix in a symmetrical manner relating to the top and the bottom surface of the chipset. Chip contacts are electrically connected by through polymer connectors that each extend from a chip contact to a surface of the polymer matrix. A film wiring line is arranged on a side of the polymer matrix for electrical connection of two through polymer connectors of two chips or a through polymer connector with an interconnect element arranged on a side of the polymer matrix.
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Hedler Harry
Irsigler Roland
Chu Chris
Qimonda AG
Slater & Matsil L.L.P.
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