Method for manufacturing a multi-layer printed circuit board

Details Method for manufacturing a multi-layer printed circuit board Method for manufacturing a multi-layer printed circuit board

2005-01-11

2005-01-11

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S830000, C029S831000, C427S097100, C427S099300

Reexamination Certificate

active

06839964

ABSTRACT:
A method of manufacturing a multilayer printed circuit board (PCB) is provided, the PCB having blind vias connecting to power layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Signal layers, provided separate from the power layers, include signal routing channels, with at least some of the signal routing channels aligned above or below the cluster of blind vias of the power layers.

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