Method for manufacturing a multi-layer capacitor

Metal working – Electric condenser making – Solid dielectric type

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156646, 156650, 361304, H01G 410

Patent

active

053476964

ABSTRACT:
For manufacturing a multi-layer capacitor, a layer structure (2, 3, 4) is applied onto a substrate (1), said layer structure comprising conductive layers (2, 4) and dielectric layers (3) in alternation and successive conductive layers (2, 4) therein being respectively formed of one of two different materials which are selectively etchable relative to one another. Two openings (6, 8) are produced in the layer structure (2, 3, 4), whereby under-etchings (21, 41 ) are formed in the first opening (6) by selective etching of the one material and are formed in the second opening (8) by selective etching of the other material, so that only the conductive layers (2, 4) of the non-etched material respectively adjoin contacts (91, 92) introduced into the openings (6, 8).

REFERENCES:
patent: 4453199 (1984-06-01), Ritchie et al.
patent: 4700457 (1987-10-01), Matsukawa
patent: 5135883 (1992-08-01), Bae et al.
patent: 5153813 (1992-10-01), Oehrlein et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing a multi-layer capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a multi-layer capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a multi-layer capacitor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2428378

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.