Method for manufacturing a mosic having self-aligned contact hol

Fishing – trapping – and vermin destroying

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437 43, 437 44, H01L 21425, H01L 2978

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active

048106666

ABSTRACT:
A method for manufacturing a MOSIC includes a step of forming a protective film of silicon nitride, which covers the top and side walls of a gate electrode structure including a doped polysilicon, a step of forming an interlayer insulating film and a step of forming a contact pattern in the interlayer insulating film immediately adjacent to a portion of the protective film in a self-aligned fashion with respect to the gate electrode structure. The presence of the protective film which covers the top and side walls of the doped polysilicon, which defines a gate electrode of a MOSFET, allows forming a pair of associated contact holes for drain and source regions in a self-aligned fashion, which contributes for higher integration.

REFERENCES:
patent: 4330931 (1982-05-01), Liu
patent: 4404733 (1983-09-01), Sasaki
patent: 4488351 (1984-12-01), Momose
patent: 4541166 (1985-09-01), Yamazaki
patent: 4551908 (1985-11-01), Nagasawa et al.
patent: 4557036 (1985-12-01), Kyuragi et al.
patent: 4616399 (1986-10-01), Ooka
patent: 4640000 (1987-02-01), Sato
patent: 4646426 (1987-03-01), Sasaki
Gargini et al., "WOS: Low-Resistance Self-Aligned Source, Drain and Gate Transistors", Technical Digest of IEDM, pp. 54-57, (1981).

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