Method for manufacturing a monolithic ceramic electronic...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S025410, C029S025420, C029S830000, C029S851000, C174S260000, C257SE23062, C257SE23070, C428S209000, C428S472000

Reexamination Certificate

active

06860006

ABSTRACT:
A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

REFERENCES:
patent: 5047283 (1991-09-01), Leatherman et al.
patent: 5792293 (1998-08-01), Inasaka
patent: 6329065 (2001-12-01), Ishida et al.
patent: 10-223801 (1998-08-01), None
patent: 11-026628 (1999-01-01), None
patent: 11-163196 (1999-06-01), None
patent: 11-312753 (1999-11-01), None
patent: 11-317490 (1999-11-01), None
patent: 2000-012736 (2000-01-01), None
patent: WO9954935 (1999-10-01), None

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