Method for manufacturing a modular semiconductor power device

Details Method for manufacturing a modular semiconductor power device Method for manufacturing a modular semiconductor power device

1989-06-27

1990-05-22

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

29832, H05K 334

Patent

active

049265474

ABSTRACT:
The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.

REFERENCES:
patent: 4518982 (1985-05-01), Du Bois et al.
patent: 4675989 (1987-06-01), Galloway et al.
patent: 4722060 (1988-01-01), Quinn et al.
patent: 4783428 (1988-11-01), Kalfus
patent: 4807018 (1989-02-01), Cellai

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