Electricity: conductors and insulators – Boxes and housings – With electrical device
Reexamination Certificate
2007-07-31
2010-11-09
Ngo, Hung V (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
With electrical device
C336S092000
Reexamination Certificate
active
07829799
ABSTRACT:
Manufacturing of miniaturised three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one polymer layer onto which layer at least one conductive path is provided.
REFERENCES:
patent: 4482934 (1984-11-01), Hirota et al.
patent: 5212345 (1993-05-01), Gutierrez
patent: 5426404 (1995-06-01), Kommrusch et al.
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 6447449 (2002-09-01), Fleischman et al.
patent: 01301880 (1989-12-01), None
patent: WO 01/25139 (2001-04-01), None
J. Yoon, C. Han, E. Yoon and C. Kim, “Monolithic Integration of 3-D Electroplated Microstructures With Unlimited Number of Levels Using Planarization With a Sacrificial Metallic Mold(PSMM),” IEEE MEMS-1999, pp. 624-629.
T. O'Donnell, P. McCloskey, M. Brunet, R. Winfield, S. O Mathuna, A. Stephen and S. Metev, “High Aspect Ratio RF Coils Fabricated Using Laser Processing and Micro-Moulding Techniques,” IMAPS—Europe Prague, Czech Republic, Jun. 18-20, 2000, pp. 169-174.
Y. Kim and M. Allen, “Surface Micromachined Solenoid Inductors for High Frequency Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part C, vol. 21, No. 1, Jan. 1998, pp. 26-33.
Mirza, N.I., “Toroidal coil winding machines making the best choice,”Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition; Oct. 4-7, 1993; pp. 243-250.
Larsson Olle
Lindström Tomas
Öhman Ove
Read Michael
Ryhänen Tapani
Fressola Alfred A.
Ngo Hung V
Nokia Corporation
Ware Fressola Van Der Sluys & Adolphson LLP
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