Method for manufacturing a microporous film having low electrica

Details Method for manufacturing a microporous film having low electrica Method for manufacturing a microporous film having low electrica

1980-01-14

1982-05-25

Anderson, Philip

Plastic and nonmetallic article shaping or treating: processes

Pore forming in situ

Composite article making

264 41, 429250, 429251, 429254, B29D 2700, H01M 216

Patent

active

043316220

ABSTRACT:
A microporous film which comprises a matrix comprising 40 to 90 volume percent of a polyolefin having a number average molecular weight of 15,000 or more and 10 to 60 volume percent of an inorganic filler, said matrix having therein void spaces at a rate of 30 to 75 volume percent based on the volume of the film; and 2 to 20 weight percent, based on the total weight of the polyolefin and the inorganic filler, of an organic substance which is substantially insoluble in and inert to sulfuric acid and has a solubility parameter ranging from 7.3 inclusive to 8.4 exclusive; said organic substance, in its majority, adhering to the overall surface of the film including the outer surfaces of the film and the surfaces of the polyolefin walls defining said void spaces in cooperation with said inorganic filler.

REFERENCES:
patent: 3351495 (1967-11-01), Larsen et al.
patent: 3853601 (1974-12-01), Taskier
patent: 3929509 (1975-12-01), Taskier
patent: 4190707 (1980-02-01), Doi et al.
patent: 4210709 (1980-07-01), Doi et al.
Brydson, J. A. "Plastics Materials" Princeton, N.J., D. Van Nostrand, c 1966, pp. 64-69.

Affiliated with

Also associated with

Rating

Method for manufacturing a microporous film having low electrica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a microporous film having low electrica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a microporous film having low electrica will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2076445