Method for manufacturing a micromechanical component and a...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S737000

Reexamination Certificate

active

06951824

ABSTRACT:
A method for manufacturing a micromechanical component, that has at least one hollow space and a functional element that is provided at least partially in the hollow space and/or a functional layer that is provided at least partially therein, and a micromechanical component that is manufactured in accordance with the method, are described. To reduce manufacturing costs, the functional element and/or the functional layer is provided with a first protective layer at least in an area that directly or indirectly borders on a first sacrificial layer, which temporarily occupies the space of the hollow space that is subsequently formed in one or a plurality of etching steps, the material of the first protective layer being selected such that at least one etching process and/or etching medium, which etches or dissolves the first sacrificial layer, either does not substantially attack the first protective layer or does so only at a reduced etching rate in comparison to the first sacrificial layer.

REFERENCES:
patent: 5627318 (1997-05-01), Fujii et al.
patent: 5846849 (1998-12-01), Shaw et al.
patent: 6067858 (2000-05-01), Clark et al.
patent: 195 37 814 (1997-04-01), None
patent: 0 138 023 (1985-04-01), None
patent: 0 451 992 (1991-10-01), None
patent: 0 890 978 (1999-01-01), None

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