Method for manufacturing a metal-ceramic substrate

Details Method for manufacturing a metal-ceramic substrate Method for manufacturing a metal-ceramic substrate

2006-08-22

2011-12-06

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S846000, C228S122100, C228S123100, C228S262210

Reexamination Certificate

active

08069561

ABSTRACT:
A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic. The metallization is applied by active soldering before patterning. An intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.

REFERENCES:
patent: 4611745 (1986-09-01), Nakahashi et al.
patent: 5465898 (1995-11-01), Schulz-Harder et al.
patent: 1 246 514 (2002-10-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing a metal-ceramic substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing a metal-ceramic substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a metal-ceramic substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4307548