Method for manufacturing a magnetic write head

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S603110, C029S603130, C029S603140, C029S603150, C029S603180, C216S062000, C216S066000, C216S067000, C360S121000, C360S122000, C360S317000, C427S127000, C427S128000, C451S005000, C451S041000

Reexamination Certificate

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08028400

ABSTRACT:
A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask structure. The first mask structure and the shrink material are then heated causing the sides of the opening in the mask structure to bulge inward. The shrink material is then removed, and a first electrically conductive material can then be electroplated into the opening to a thickness that is much less than the thickness of the mask. The bulbous shaped of the deformed photoresist mask forms a taper on the first electrically conductive material. The first mask can then be removed and a second electrically conductive material can be electroplated over the first electrically conductive material.

REFERENCES:
patent: 5066616 (1991-11-01), Gordon
patent: 7186348 (2007-03-01), Chen et al.
patent: 7371400 (2008-05-01), Borenstein et al.
patent: 2003/0170571 (2003-09-01), Nozaki et al.
patent: 2006/0096081 (2006-05-01), Bonhote et al.
patent: 2007/0020386 (2007-01-01), Bedell et al.
patent: 2007/0106021 (2007-05-01), Kozawa et al.
patent: 2007/0139816 (2007-06-01), Chen et al.
patent: 2007/0224537 (2007-09-01), Nozaki et al.

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