Method for manufacturing a magnetic write head

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S603130, C029S603150, C029S603180, C216S062000, C216S065000, C216S066000, C204S192340, C360S122000, C360S317000, C451S005000, C451S041000

Reexamination Certificate

active

07454828

ABSTRACT:
A method for measuring recession in a wafer undergoing an asymmetrical ion mill process. The method includes the formation of first and second reference features and possibly a dummy feature. The reference features are constructed such that the location of the midpoint between them is unaffected by the asymmetrical ion mill. By measuring the distance between a portion of the dummy feature and the midpoint between the reference features, the amount of recession of the dummy feature can be measured. The measurement can be used to calculate the relative location of the flare to the read sensor rear edge through overlay information. By keeping the angles of the sides of the features steep (ie. nearly parallel with the direction in which the ion mill is asymmetrical) the amount of material consumed on each of the reference features is substantially equal and the midpoint between the reference features is substantially stationary.

REFERENCES:
patent: 5995343 (1999-11-01), Imamura
patent: 6521902 (2003-02-01), Chang et al.
patent: 6651313 (2003-11-01), Chang et al.
patent: 7002775 (2006-02-01), Hsu et al.
patent: 2005/0218324 (2005-10-01), Street
patent: 2006/0143900 (2006-07-01), Peterson et al.

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