Method for manufacturing a liquid jet recording head

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C347S063000, C347S085000, C347S087000, C347S095000

Reexamination Certificate

active

06349239

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for manufacturing a liquid jet recording head used for a liquid jet recording apparatus or the like. More particularly, the invention relates to a method for manufacturing a liquid jet recording head which is structured by combining an element substrate having an array of discharge energy generating elements with a ceiling plate having arrays of discharge ports and flow path grooves.
2. Related Background Art
A liquid jet recording head used for a liquid jet recording apparatus or the like comprises an element substrate having a plurality of discharge energy generating elements (electrothermal converting elements, for example) formed at given intervals, and a ceiling plate having a plurality of discharge ports formed for discharging ink or some other liquid, as well as a plurality of flow path grooves conductively connected with each of the discharge ports. The element substrate and the ceiling plate are combined and bonded in a state where the discharge energy generating elements, the discharge ports, and the flow path grooves are positioned exactly. Then, the head is structured to apply discharge energy to liquid in each of the flow path grooves by means of discharge energy generating elements, thus discharging liquid from the discharge ports as droplets to record prints on a recording medium.
As shown in
FIGS. 8A and 8B
, a liquid jet recording head of the kind comprises an element substrate (heater board)
51
having cut faces
51
a
and
51
a
on both ends thereof, which is provided with a plurality of discharge energy generating elements (electrothermal transducing devices or heaters)
52
formed and arranged by means of micro-precision etching technologies and techniques on the element substrate at given intervals; and a ceiling plate
53
having a plurality of discharge ports
54
formed in a given precision by use of laser processing or the like, as well as a plurality of flow path grooves
55
conductively connected with each of the discharge ports, and also, a common liquid chamber
56
and a liquid supply inlet port
57
. The element substrate
51
and the ceiling plate
53
are fixed by the application of bonding agent or by use of a spring or the like in a state that the respective discharge energy generating elements
52
on the element substrate
51
, and the discharge ports
54
and the flow path grooves
55
on the ceiling plate
53
are positioned correspondingly, thus forming a liquid jet recording head.
Now, however, when an element substrate of the kind is combined with the ceiling plate, the accuracy of micron order is required for positioning the discharge energy generating elements on the element substrate, and the discharge ports and flow path grooves of the ceiling plate. In this respect, there are disclosed in Japanese Patent Application Laid-Open No. 4-171126, Japanese Patent Application Laid-Open No. 4-171130, and Japanese Patent Application Laid-Open No. 4-171163, among some others, methods for manufacturing an liquid jet recording head wherein positioning is made precisely adjustable when the element substrate and ceiling plate are combined. These methods for manufacturing a liquid jet recording head are such that at first, the positions of the discharge energy generating elements (heaters), which should be formed on an element substrate (heater board), are measured by means of image processing or the like, and then, a ceiling plate is allowed to shift onto the element substrate, and that the ceiling plate is subsequently moved relatively with respect to the element substrate, while measuring the positions of the discharge ports or flow path grooves formed on the ceiling plate by means of image processing or the like, so that the positions of discharge ports or the flow path grooves agree with those of the discharge energy generating elements on the element substrate. In this manner, the element substrate and the ceiling plate are arranged, and when the discharge energy generating elements, discharge ports, and flow path grooves are positioned exactly in agreement with each other, the substrate and plate are bonded and fixed by the application of a bonding agent or by use of a spring or the like.
Also, between the discharge energy generating elements (heaters) formed on the element substrate, there are arranged recessed portions, respectively, which engage with the flow path walls that constitute the flow path grooves of the ceiling plate. Then, the end face of the element substrate is allowed to abut upon the reference surface which is provided for the ceiling plate in advance. After that, the ceiling plate is caused to shift by the application of vibrations. In this manner, the flow path walls of the ceiling plate engages with the recessed portions arranged on the element substrate. This method, which is disclosed in the specification of Japanese Patent Application Laid-Open No. 7-89073 filed by the applicant hereof, makes it possible to position the element substrate and the ceiling plate quickly. Further, the applicant hereof has proposed a method wherein an abutment reference is arranged in advance for the ceiling plate for use of its bonding with the element substrate, and then, after the ceiling plate has shifted onto the element substrate, the end face of the element substrate is caused to abut upon the abutment reference of the ceiling plate, hence making it possible to execute the positioning of the element substrate and ceiling plate quickly with ease.
However, each of the conventional methods for manufacturing a liquid jet recording head that have been described above still has problems yet to be solved as given below.
In other words, as to the method wherein the positions of the discharge energy generating elements on the element substrate are measured by means of image processing or the like, and the element substrate and the ceiling plate are positioned by moving them relatively, while measuring the positions of the discharge ports of the ceiling plate by means of the image processing or the like, an operation is needed to move the ceiling plate after the positions of the discharge energy generating elements on the element substrate have been measured. Further, it is required to repeatedly measure the positions of the discharge ports of the ceiling plate, and move it several times until the positions of the discharge energy generating elements on the element substrate and those of the discharge ports of the ceiling plate agree with each other. As a result, a problem is encountered that the tact time should increase. Also, the positioning is carried out while the measurements are made by means of a non-contact type, such as image processing method. Therefore, it is inevitable that the structure of a system becomes complicated, resulting in higher costs, and that the time required for making adjustment for each part becomes different due to the difference in the adjustments necessitated to be made by the varied precisions in which the element substrates are cut. This complicated structure of the system may hinder balancing the line tacts, and further, may make it difficult to carry out the required positioning in a shorter period of time.
Also, for the method wherein the element substrate and the ceiling plate are positioned by the provision of the positioning recesses between the plural discharge energy generating elements (heaters) on the element substrate or the method wherein the element substrate and the ceiling plate are positioned by allowing the end face of the element substrate to abut upon the abutment reference arranged for the ceiling plate, it is difficult to form the positioning recesses between the discharge energy generating elements if the devices are arranged in high density on an element substrate which is adopted for use of a highly densified recording head, such as 600 dpi or more, although this method makes it possible to carry out the positioning quickly with ease. Also, for the method wherein the end face of the

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