Method for manufacturing a light weight circuit module

Details Method for manufacturing a light weight circuit module Method for manufacturing a light weight circuit module

1993-07-06

1994-04-12

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29846, 156654, 156656, 1566591, 156666, 174250, 174261, 205125, 205159, 205183, H05K 334

Patent

active

053014200

ABSTRACT:
A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.

REFERENCES:
patent: 3740819 (1973-06-01), Babusci et al.
patent: 3859177 (1975-01-01), Gigoux

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