Method for manufacturing a light emitting diode having a...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S047000, C257S079000

Reexamination Certificate

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06972208

ABSTRACT:
A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.

REFERENCES:
patent: 6503831 (2003-01-01), Speakman
patent: 6522063 (2003-02-01), Chen et al.
patent: 6563139 (2003-05-01), Hen
patent: 6693352 (2004-02-01), Huang et al.
patent: 6709883 (2004-03-01), Yang et al.
patent: 2002/0036296 (2002-03-01), Akaike et al.
patent: 2003/0047737 (2003-03-01), Lin et al.
patent: 2003/0143772 (2003-07-01), Chen

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