Method for manufacturing a light emitting diode device

Details Method for manufacturing a light emitting diode device Method for manufacturing a light emitting diode device

2006-06-20

2006-06-20

Kang, Donghee (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S029000, C438S034000, C438S035000

Reexamination Certificate

active

07063996

ABSTRACT:
A method for manufacturing light emitting diode device by mounting an LED on a substrate, providing electrodes to connect the substrate to the LED for applying a current to the LED, encapsulating the LED with an encapsulating resin, measuring chromaticity of light emitted from the encapsulated LED, calculating a correcting chromaticity necessary for correcting the measured chromaticity of the light from the encapsulated LED to a desired chromaticity, preparing filter agents for the correcting chromaticity of light from the encapsulated LED and applying the adjusted filter agents to the surface of the encapsulating resin.

REFERENCES:
patent: 6521915 (2003-02-01), Odaki et al.
patent: 2001/0000622 (2001-05-01), Reeh et al.
patent: 2001/0030326 (2001-10-01), Reeh et al.
patent: 10163535 (1998-06-01), None
patent: 10307205 (1998-11-01), None
patent: 11087784 (1999-03-01), None
patent: 11273625 (1999-10-01), None
patent: 2001107036 (2001-04-01), None

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