Method for manufacturing a light emitting diode device

Details Method for manufacturing a light emitting diode device Method for manufacturing a light emitting diode device

2005-07-26

2005-07-26

Everhart, Caridad M. (Department: 2825)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S025000, C438S040000, C438S113000

Reexamination Certificate

active

06921674

ABSTRACT:
A light emitting diode device has a body having a recess. The body comprises a pair of half bodies made of metal, an insulation layer provided between the half bodies. An LED is mounted on a bottom of the recess and connected with the half bodies by bumps. The recess is closed by a transparent sealing plate.

REFERENCES:
patent: 6034712 (2000-03-01), Iwasaki
patent: 6483101 (2002-11-01), Webster

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