Method for manufacturing a light-emitting device with a...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

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C257SE33027

Reexamination Certificate

active

07736926

ABSTRACT:
The invention provides a light-emitting device, where the active region thereof may be escaped from being damaged by the plasma process. The device is first formed with a semiconductor layer on the semiconductor substrate, next provided with an etching mask. Using the mask, the semiconductor layer on the substrate is dry-etched to form a periodic structure with grooves and mesas. The active regions are buried within the grooves by the OMVPE method.

REFERENCES:
patent: 6365428 (2002-04-01), Zubrzycki et al.
patent: 3-49284 (1991-03-01), None
patent: 3-49287 (1991-03-01), None
patent: 7-221392 (1995-08-01), None
patent: 10-270793 (1998-10-01), None
patent: 11-54835 (1999-02-01), None
patent: 2000-91303 (2000-03-01), None
patent: 2001-156391 (2001-06-01), None
patent: 2002-33305 (2002-01-01), None
patent: 2003-142773 (2003-05-01), None
patent: 2004-55797 (2004-02-01), None
Notification of Reasons of Rejection.

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