Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-11-28
2006-11-28
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S016000, C257SE21529
Reexamination Certificate
active
07141442
ABSTRACT:
A method for manufacturing an LED device includes the steps of mounting an LED on a substrate, sealing the LED with a transparent resin including phosphor particles to form an LED device before being dyed, measuring chromaticity of light from the LED device before being dyed; and dyeing the sealing resin by a dye having a color for correcting the measured chromaticity to a desired color.
REFERENCES:
patent: 6319425 (2001-11-01), Tasaki et al.
patent: 6686105 (2004-02-01), Washizu et al.
patent: 6888173 (2005-05-01), Ishii et al.
patent: 6965191 (2005-11-01), Koike et al.
Citizen Electronics Co. Ltd
Dennison, Schultz & McDonald
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