Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-02-22
2005-02-22
Dang, Trung (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S028000, C438S029000, C438S034000
Reexamination Certificate
active
06858456
ABSTRACT:
Light emitting elements are mounted on substrates to produce a plurality of light emitting element units and a plurality of cover members are manufactured. Each of the cover members includes phosphor particles and pigment particles. Wavelength and luminance of light emitted from the light emitting element of each of the light emitting element units is measured. The measured wavelengths and luminances of lights emitted from the light emitting elements are classified into ranks. The wavelengths of lights emitted from the phosphor particles are classified into ranks and the mixing ratios of pigments are classified. Ranks of the light emitting elements and ranks of the cover members are classified into groups in accordance with desired characteristic. A light emitting element and a cover member belonging to same group are mounted in a case.
REFERENCES:
patent: 6069440 (2000-05-01), Shimizu et al.
patent: 6319425 (2001-11-01), Tasaki et al.
patent: 6333522 (2001-12-01), Inoue et al.
patent: 6351069 (2002-02-01), Lowery et al.
patent: 09330611 (1997-12-01), None
patent: 2001222242 (2001-08-01), None
Horiuchi Megumi
Noguchi Katsuhiko
Citizen Electronics Co. Ltd.
Dang Trung
Dennison Schultz Dougherty & MacDonald
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