Surgery – Means for introducing or removing material from body for... – Treating material introduced into or removed from body...
Reexamination Certificate
2007-08-21
2007-08-21
Kennedy, Sharon E. (Department: 1615)
Surgery
Means for introducing or removing material from body for...
Treating material introduced into or removed from body...
C427S236000
Reexamination Certificate
active
10424506
ABSTRACT:
Method for producing a syringe with a glued cannula, in which a syringe body is provided with a lubricant internally at high temperature, and either the lubricant is prevented from penetrating into a cannula receptacle of the syringe body, or the lubricant is cleared from the cannula receptacle of the syringe body afterward, and a cannula is glued into the cannula receptacle; and a syringe with a body comprising a cylinder portion and a narrowed cannula receptacle portion, whereby the cylinder portion is provided internally with a lubricant—this being deposited at high temperature—a cannula receptacle of the receptacle portion is cleared of lubricant, and a cannula is glued into the cannula receptacle.
REFERENCES:
patent: 4046616 (1977-09-01), Klein
patent: 4781701 (1988-11-01), Geprags
patent: 5456940 (1995-10-01), Funderburk
patent: 5540666 (1996-07-01), Barta et al.
patent: 5683536 (1997-11-01), Kneafsey
patent: 6093175 (2000-07-01), Gyure et al.
patent: 2002/0012741 (2002-01-01), Heinz et al.
patent: 2002/0138042 (2002-09-01), Llorach et al.
Brandhorst Erik
Geiger Andreas
Gerresheimer Buende GmbH
Greenberg Laurence A.
Kennedy Sharon E.
Locher Ralph E.
Stemer Werner H.
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