Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-07-08
1995-06-13
Vo, Peter Dungba
Metal working
Method of mechanical manufacture
Electrical device making
29840, 174 522, 174 523, 2281246, H01L 2314, H05K 506
Patent
active
054231191
ABSTRACT:
A method for manufacturing a hybrid circuit-type charge-coupled device image sensor includes the steps of: forming a lead wire unit on a first layout surface of a ceramic base; attaching a charge-coupled device image sensor die on the first layout surface; wire bonding the charge-coupled device image sensor die to the lead wire unit; mounting a window frame on the first layout surface to enclose the charge-coupled device image sensor die by applying a layer of sealing material on a lower peripheral end of the window frame; mounting a glass lid on the window frame by applying another layer of sealing material on an upper peripheral end of the window frame; and heating an assembly of the glass lid, the window frame and the ceramic base in an oven so as to cure and harden the layers of sealing material and bond together the glass lid, the window frame and the ceramic base.
REFERENCES:
patent: 3729820 (1973-05-01), Ihochi et al.
patent: 3740838 (1973-06-01), Brookover et al.
patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4715115 (1987-12-01), King et al.
patent: 4829403 (1989-05-01), Harding
Dungba Vo Peter
Hualon Microelectronics Corporation
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