Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-03-14
2006-03-14
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S456000, C438S125000
Reexamination Certificate
active
07011986
ABSTRACT:
In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a micromechanical structure lying between second contact elements at the chip is provided with a photolithographically patternable layer which is patterned in order to provide a recess in the area of the micromechanical structure and in the area of the second contact elements. After joining the base and the chip the base is removed by etching.
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Daeche Frank
Timme Hans-Joerg
Infineon - Technologies AG
Slater & Matsil L.L.P.
Thai Luan
LandOfFree
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