Electric heating – Metal heating – By arc
Reexamination Certificate
1999-07-06
2001-04-10
Heinrich, Samuel M. (Department: 1725)
Electric heating
Metal heating
By arc
Reexamination Certificate
active
06215098
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for manufacturing a holding tray for chip components such as monolithic chip capacitors and chip resistors, and more specifically, relates to a manufacturing method for a holding tray used in processes of attaching terminals to chip components, measuring chip components, and so forth.
2. Description of the Related Art
Hitherto, a jig, being called “a holding tray”, has been used for attaching terminals to chip components such as monolithic chip capacitors. The holding tray is provided with a hard substrate comprising a frame portion, a flat board portion unitarily formed with the inner peripheral surfaces of the frame portion, and a plurality of through-holes formed in the flat board portion. An elastic member is formed in a region surrounded by the frame portion of the hard substrate and holding holes having smaller diameters than those of the through-holes are made through on the elastic member at the positions corresponding to those of the through-holes.
A method for manufacturing the holding tray disclosed in Japanese Examined Patent Publication No. 5-42123 is known. That is, pins having diameters smaller than those of the through-holes are inserted into the through-holes formed in the flat portion of the prepared hard substrate so that liquid elastic material is poured on the hard substrate in a state in which pins are inserted. After the elastic material is cured, holding holes are formed by removing the pins. In the above-mentioned method, the holding holes are formed by molding the elastic material using a metallic mold having the pins.
In the above-mentioned method, molding is easy, however, there has been a problem in that accuracy in the position and dimensions of the holding hole is deteriorated by residual stress in the elastic member produced during molding. There are some cases in which flash is produced around the holding holes and it is disadvantageous to take time to remove the flash. It is a further disadvantage to make an expensive mold having a large number of pins and an extended production period.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention is to provide a method for manufacturing a holding tray for chip components in which residual stress in an elastic member does not affect the accuracy of making holes, and a metallic mold is not required.
In order to attain the above-mentioned object, in accordance with one aspect of the present invention, a method for manufacturing a holding tray comprises the steps of preparing a hard substrate including a frame portion, a flat board portion unitarily formed with the inner peripheral surfaces of the frame portion, and a plurality of through-holes formed on the flat board portion; forming an elastic member in a region surrounded by the frame portion of the hard substrate; and forming holding holes smaller than the through-holes by means of laser machining at areas in the elastic member, the positions of the holding holes corresponding to positions of the through-holes.
In the first place, a holding tray having no holding hole is manufactured by forming an elastic member on the hard substrate. As for a method for forming the elastic member, for example, after the hard substrate is positioned between upper and lower molds, the elastic member may be formed by curing liquid elastic material charged inside of the frame body; after an elastic material is positioned on one side surface or both side surfaces of the hard substrate, the elastic member may be unitarily formed with the hard substrate by embedding the elastic material inside the frame body by means of a hot-press. After forming the elastic member, a holding hole is made therethrough by irradiating the corresponding position to that of the through-hole on the elastic member with a laser beam so that the local area is burned off. Since the laser beam has an extremely large amount of energy at that time, limited and deep machining can be performed, so that the holding hole can be simply formed without flash. Therefore, residual stress is not generated around the holding hole which is different from the situation of molding; moreover, since the region beyond the required area is not burned off, accuracy in the position and dimensions of the holding hole is not deteriorated.
As for methods for laser machining on the elastic member, for example, the holding hole may be formed using a laser beam having approximately the same diameter as that of the holding hole machining may be performed after forming a beam shape using a mask. It may be preferable that the holding hole be machined by turning around of a laser beam having a smaller diameter than that of the holding hole. That is, the laser beam diameter may be reduced to be as small as possible, so that the inner surface of the holding hole is more neatly machined, resulting higher accuracy in hole diameter.
In addition, in accordance with the present invention, a pulse-oscillating CO2 laser among YAG, CO2 lasers, etc., is preferable, by which it is difficult to thermally affect materials.
REFERENCES:
patent: 3226527 (1965-12-01), Harding
patent: 3524046 (1970-08-01), Brouwer
patent: 3742182 (1973-06-01), Saunders
patent: 4099615 (1978-07-01), Lemke et al.
patent: 5336554 (1994-08-01), Knight
patent: 5337893 (1994-08-01), Nami et al.
patent: 2150038 (1985-06-01), None
patent: 57-28693 (1982-02-01), None
patent: 59-191583 (1984-10-01), None
patent: 1-228692 (1989-09-01), None
patent: 5-42123 (1993-06-01), None
Burns Doane , Swecker, Mathis LLP
Heinrich Samuel M.
Murata Manufacturing Co. Ltd.
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