Method for manufacturing a high density electronic circuit assem

Details Method for manufacturing a high density electronic circuit assem Method for manufacturing a high density electronic circuit assem

1996-05-30

1997-09-09

Picardat, Kevin

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

H01L 2160

Patent

active

056656505

ABSTRACT:
Photoimageable dielectric materials are coated on substrates, selectively exposed and developed, whereby small vias and interconnection openings are formed between adjacently spaced circuit layers. A conductive paste may be used to provide sequential layer interconnection and surface planarization. No adhesives are required in the manufacture of a circuit assembly having multiple circuit and dielectric layers, and the manufacturing method avoids the requirement for drilled through holes and blind vias.

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"New Avenue for Microvias", Electronics Engineering Times, Mar. 18, 1996, p. 68.

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