Method for manufacturing a flip chip semiconductor device

Details Method for manufacturing a flip chip semiconductor device Method for manufacturing a flip chip semiconductor device

1999-07-09

2000-05-09

Picardat, Kevin M.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438612, 438977, 148DIG135, H01L 2130, H01L 2146

Patent

active

060603739

ABSTRACT:
A plurality of pad electrodes are formed on a first surface of an IC wafer, and a solder layer is formed on each of the pad electrodes. The first surface of the IC wafer including solder layers is coated with a flux layer, and solder layers are reflowed to round each of the solder layers, thereby forming each solder layer into a solder bump. An adhesive tape is adhered on the flux layer, and a second surface opposite to the first surface of the IC wafer is ground to form a flip chip semiconductor device.

REFERENCES:
patent: 5574285 (1996-11-01), Marion et al.
patent: 5909634 (1999-06-01), Hotchkiss et al.
patent: 5953623 (1999-09-01), Boyko et al.
patent: 5989939 (1999-11-01), Fjelstad

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