Chemistry: electrical and wave energy – Processes and products
Patent
1981-11-20
1983-08-30
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204281, C25D 100, C25D 120
Patent
active
044015216
ABSTRACT:
A method for manufacturing a fine-patterned thick film conductor structure free from ununiformity in film thickness comprises steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to form conductors having a circuit density of no less than three lines/mm and a thickness of 15-200 .mu.m, bonding the electroplated thin metal plate to an insulative substrate with the thin metal plate side facing up and etching the thin metal plate. The fine-patterned conductors are suited for use in small-sized coils, high density connectors and high density wirings.
Further disclosed is a method for manufacturing a fine-patterned thick film printed circuit board free from side protrusion comprising steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate to a thickness of 0.3-10 .mu.m at a current density of 0.05-2 A/dm.sup.2, electroplating the thin metal plate to a desired final thickness at a current density of 3-20 A/dm.sup.2, and removing all or the areas other than the land areas of the thin metal plate.
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Kimura Takeo
Koyama Ryohei
Ohmura Kaoru
Asahi Kasei Kogyo Kabushiki Kaisha
Tufariello T. M.
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